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Silicone potting adhesive series

Silicone potting glue series models: 9100.9101.9102.9102 b. 9104 brands: god sealing silicone potting……

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Silicone potting adhesive series
Model: 9100.9101.9102.9102 b. 9104
Brand: Feng Shen

Silicone potting adhesive is mainly used for potting components and circuit boards in electronic industry. It can form a transparent protective film on a variety of printed circuit boards to prevent leakage and short circuit caused by moisture erosion, to prevent weak acids and alkalis, alcohol, mold and salt spray, this product is resistant to high temperature and will not drip in case of heat. The main functions of this product: waterproof, moisture-proof, shock-proof, anti-mechanical damage, improve insulation strength, and isolate the contact between wire, cable, wire connector, switch box and air. It can also be used to prevent corona caused by leakage of components such as high voltage packs in TV sets. It can also prevent fire gas from high frequency antenna communication transmission equipment, and electronic equipment from salt spray erosion.

Packing specification: 15kg/ barrel, can be more customized


Sealing silicon Potting adhesive series:
FS-9100PCB high temperature moisture proof adhesive
1. Product description
PCB high temperature moisture proof adhesive is a single component, low modulus, neutral curing silicon elastic sealant specially designed for potting protection in PCB board and other fields.
Second, product characteristics
◆. Low viscosity, good flow, easy to operate;
◆ Weather aging resistance, yellowing resistance, moisture-proof and waterproof performance;
◆. High and low temperature resistance, performance changes little in the range of -50℃~+180℃, can be used;
◆. After curing, good adsorption;


Third, product technical parameters

colour

Transparent, white or black

viscosity

1000 + 100

Specific gravity

1.0 to 1.04g/cm3

Hardness (Shore A)

20 ~ 25

Tensile strength

0.8 MPa

Shear strength

1.0 MPa

Elongation at break

150

Service temperature range

-50 ~ 180℃

Breakdown voltage

20Kv/mm

Volume resistivity

1 x 1015 Ω * CM or greater

Dielectric constant

2.8 (1MHz)

Surface drying time

180 min (20℃, 50RH)

 

4. Methods of use

◆ Determine the base material

Firstly, the factors that cannot be determined are excluded, such as certain metal coatings and paint layers.

Loose layer where sizing is required. If there is a coating or paint layer, ensure that there is sufficient adhesion.

If the adhesion is not strong, special cleaning agent can be used to clean the parts to be gummed, so that it is clean, hard, dry and free of grease and surface dirt such as release agent, curing film and hydrophobic agent.

◆ Sizing

Depending on the size of the PCB board, choose the appropriate brush board to brush directly, or pour directly. Automatic defoaming after flowing. Excess glue is cleaned before curing. The parts can enter the next process after 3 hours. Strength is reached after 24 hours (too low ambient temperature will cause surface drying time and curing time to slow down).

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

5. Storage and shelf life

It belongs to non-dangerous goods, please store in a cool and dry place where the temperature is below 30℃, the shelf life is 12 months, and pay attention to sealing after use. If there is slight rubber skin on the surface due to sealing, it will not affect the use.

6. Precautions: After curing, but before curing, avoid contact with eyes and children.

7. Packing specification: 15kg/ barrel


 

FS-9101 electronic potting adhesive  

1. Product description

Electronic potting adhesive is a single component, low modulus, neutral fast curing silicon elastic sealant specially designed for the potting protection of LED, circuit board and wire.

Second, product characteristics

◆ Moderate viscosity, good flow, easy operation, high transparency;
◆ Weather aging resistance, yellowing resistance, moisture and waterproof performance;

◆. Good flexibility, bending resistance;

◆ High and low temperature resistance, little change in performance in the range of -50℃~+180℃;

◆. Good adsorption after curing;

Third, product technical parameters

colour

transparent

viscosity

20000 + 500

Specific gravity

1.0 to 1.04g/cm3

Hardness (Shore A)

20 ~ 25

Tensile strength

0.8 MPa

Shear strength

1.0 MPa

Elongation at break

150

Service temperature range

-50 ~ 180℃

Breakdown voltage

20Kv/mm

Volume resistivity

1 x 1015 Ω * CM or greater

Dielectric constant

2.8 (1MHz)

Surface drying time

5 minutes (20℃, 50 RH)

 

4. Methods of use

◆ Determine the base material

Firstly, the factors that cannot be determined are excluded, such as certain metal coatings and paint layers.

Loose layer where sizing is required. If there is a coating or paint layer, ensure that there is sufficient adhesion.

If the adhesion is not strong, special cleaning agent can be used to clean the parts to be gummed, so that it is clean, hard, dry and free of grease and surface dirt such as release agent, curing film and hydrophobic agent.

◆ Sizing

Direct dumping. Automatic defoaming after flowing. Excess glue is cleaned before curing. The parts can enter the next process after 3 hours. Strength is reached after 24 hours (too low ambient temperature will cause surface drying time and curing time to slow down).

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

5. Storage and shelf life

It belongs to non-dangerous goods, please store in a cool and dry place where the temperature is below 30℃, the shelf life is 12 months, and pay attention to sealing after use. If there is slight rubber skin on the surface due to sealing, it will not affect the use.

Vi. Precautions: After curing, but before curing, avoid contact with eyes and children;

Seven, packaging specifications: 70g/ pieces, 100 pieces/box

 


 

FS-9102 electronic potting adhesive

1. Product description

Electronic potting adhesive is a single component, low modulus, neutral curing silicon elastic sealant designed for the potting protection of electronic components, light emitting tubes, electrical modules, etc.

Second, product characteristics

◆. Moderate viscosity, good flow, easy to operate;
◆ Weather aging resistance, yellowing resistance, moisture-proof and waterproof performance;

◆. Good flexibility, bending resistance, good elasticity;

◆. High and low temperature resistance, performance changes little in the range of -50℃~+250℃, can be used;

◆. Curing, good adsorption, resistance to chemical media;

Third, product technical parameters

Typical technical parameter
 

colour

Transparent, translucent, white, black

viscosity

10000 + 500

Specific gravity

1.0 to 1.04g/cm3

Hardness (Shore A)

20 ~ 25

Tensile strength

> 0.5 MPa

Shear strength

> 0.5 MPa

Elongation at break

200

Service temperature range

-50 ~ 250℃

Breakdown voltage

20Kv/mm

Volume resistivity

5 * 1016 or higher Ω * CM

Dielectric constant

2.8 (1MHz)

Surface drying time

30 minutes (20℃, 50 RH)

 

4. Methods of use

◆ Determine the base material

Loose layer where sizing is required. If there is a coating or paint layer, ensure that there is sufficient adhesion.

If the adhesion is not strong, special cleaning agent can be used to clean the parts to be gummed, so that it is clean, hard, dry and free of grease and surface dirt such as release agent, curing film and hydrophobic agent.

◆ Sizing

Direct dumping. Automatic defoaming after flowing. Excess glue is cleaned before curing. Parts can enter the next process after 3 hours (too low ambient temperature will cause surface drying time and curing time to slow down).

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

5. Storage and shelf life

It belongs to non-dangerous goods, please store in a cool and dry place where the temperature is below 30℃, the shelf life is 12 months, and pay attention to sealing after use. If there is slight rubber skin on the surface due to sealing, it will not affect the use.

Vi. Precautions: After curing, but before curing, avoid contact with eyes and children;

Seven, packaging specifications: 70g/ pieces, 100 pieces/box

 

 

 

FS-9102B electronic potting adhesive  

1. Product description

Electronic potting adhesive is a single component, low modulus, neutral curing silicon elastic sealant specially designed for the potting protection of electronic components that need high temperature resistance.

Second, product characteristics

◆. Moderate viscosity, good flow, easy to operate;

◆ Weather aging resistance, yellowing resistance, moisture-proof and waterproof performance;

◆. Good flexibility, bending resistance, good elasticity, high strength;

◆ High and low temperature resistance performance in the range of -50℃~+250℃ performance change little, can be used;

◆. After curing, good absorption, resistance to chemical media;

Third, product technical parameters
Typical technical parameter

colour

White, black, red

viscosity

20000 + 500

Specific gravity

1.0 to 1.04g/cm3

Hardness (Shore A)

25 ~ 30

Tensile strength

> 1.5 MPa

Shear strength

> 1.0 MPa

Elongation at break

200

Service temperature range

-50 ~ 250℃

Breakdown voltage

20Kv/mm

Volume resistivity

5 * 1016 or higher Ω * CM

Dielectric constant

2.8 (1MHz)

Surface drying time

30 minutes (20℃, 50 RH)

 

4. Methods of use

◆ Determine the base material

Loose layer where sizing is required. If there is a coating or paint layer, ensure that there is sufficient adhesion.

If the adhesion is not strong, special cleaning agent can be used to clean the parts to be gummed, so that it is clean, hard, dry and free of grease and surface dirt such as release agent, curing film and hydrophobic agent.

◆ Sizing

Direct dumping. Automatic defoaming after flowing. Excess glue is cleaned before curing. Parts can enter the next process after 3 hours (too low ambient temperature will cause surface drying time and curing time to slow down).

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

5. Storage and shelf life

It belongs to non-dangerous goods, please store in a cool and dry place where the temperature is below 30℃, the shelf life is 12 months, and pay attention to sealing after use. If there is slight rubber skin on the surface due to sealing, it will not affect the use.

6. Precautions: After curing, but before curing, avoid contact with eyes and children

Seven, packaging specifications: 70g/ pieces, 100 pieces/box

 

 

 

FS-9103 two-component potting adhesive
 

1. Product description

Two-component potting adhesive is a neutral curing silicone elastic sealant specially designed for potting protection of electronic components, modules and circuit boards with large potting thickness.

Second, product characteristics

◆. Low viscosity, good flow, easy to operate;

◆ Weather aging resistance, yellowing resistance, moisture-proof and waterproof performance

◆. Good curing performance, good flexibility, bending resistance, good elasticity, high strength;

◆. High and low temperature resistance, performance changes little in the range of -50℃~+250℃, can be used;

◆. After curing, it has good absorption for most plastics and is resistant to chemical media;

Third, product technical parameters

Typical technical parameter

precure

colour

White, black, red

viscosity

2000 + 100

Specific gravity

1.2 to 1.4g/cm3

Mixing ratio

A:B= 10:1

After curing

Mixed viscosity

1200 + 100

Shore A hardness

15 ~ 20

Line shrinkage rate

0.5

Service temperature range

-50 ~ 250℃

Breakdown voltage

20Kv/mm

Volume resistivity

5 * 1016 or higher Ω * CM

Dielectric constant

2.8 (100KHz)

Initial curing time

2H (20℃, 50RH)

 

4. Methods of use

Metrology: Accurately weigh component A and component B (curing agent).

Stir: Add component B to the container containing component A and mix well.

Potting: Put the mixed adhesive into the product that needs to be potting as soon as possible.

Curing: The potting parts are cured at room temperature, and enter the next process after initial solidification, which takes 10 to 24 hours.

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

5. Storage and shelf life

It belongs to non-dangerous goods, please store in a cool and dry place where the temperature is below 30℃, the shelf life is 12 months, and pay attention to sealing after use. If there is slight rubber skin on the surface due to sealing, it will not affect the use.

Note: This product is cured, but before curing should avoid contact with eyes, children;

7. Packing specification: 15kg/ group

 

 

 

FS-9104 plus formed thermal potting adhesive
 

1. Product description

Molded silicon potting adhesive is a two-component silicone elastic sealant which is specially designed for potting protection of products that control curing time and can play a waterproof, moisture-proof and anti-gas pollution role.

Second, product characteristics

◆ Two components, long operating time, fast curing after heating, curing time control;

◆. No by-products after curing, no shrinkage.

◆. Electrical performance and resistance to high and low temperature after curing;

Third, product technical parameters

Typical technical parameter

precure

colour

transparent

viscosity

1000 + 100

Specific gravity

1.2 to 1.4g/cm3

Mixing ratio

A:B= 1:1

After curing

Mixed viscosity

1000 + 100

Breakdown voltage

16Kv/mm

Volume resistivity

1 x 1015 Ω * CM or greater

Curing condition

℃/min

25/360 or 80/30

Thermal conductivity

0.8

 

4. Methods of use

Metrology: Accurately weigh component A and component B.

Stir: Add component B to the container containing component A and mix well.

Potting: Put the mixed adhesive into the product that needs to be potting as soon as possible.

Curing: The pot-sealed parts are cured at room temperature or heated to 80 degrees.

After vulcanization, the residual film can be cut off with a sharp knife, but it is not allowed to tear by hand.

Note: Some conditions may cause the silicone potting glue to fail to cure, which can be avoided by cleaning the surface with solvents

Exposure to the following chemicals will prevent the silicone potting glue from curing

-- Tin compounds and tin-containing silicone rubber

-- Sulfur, sulfide and sulfur-containing rubber and other materials

-- Amines and materials containing amines

5. Packing specification: 50kg/ group


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