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Product description:
FS-9103 is two components neutral organosilicon elastic sealant for potting and protecting thick electronic components, module an PCB.
Product Features:
1. Middle viscosity, good flowability, easy to operate.
2. Good performance of resisting climate;Moistureproof and waterproof.
3. Good flexibility and bending resistance.
4. Good high/low temperature resistance. It works well from -50°C to 250°C.
5.Non-toxic after curing, good plastic adsorbability and chemical resistance.
Technical data sheet:
Before curing | Color | White, black and red | Viscosity | 2000±100 |
Ratio | 1.2～1.4g/cm3 | Mix ratio | A:B=10：1 | |
After curing | Viscosity after mixing | 1200±100 | Hardness Shore-A | 15～20 |
Linear shrinkage | 0.5% | Working temperature | -50～250℃ | |
Breakdown voltage | 20Kv/mm | Volume resistivity | ≥5×1016Ω*CM | |
Dielectric constant | 2.8（100KHz） | Initial curing time | 2H（20℃，50% RH） |
Usage method:
1. Metering: Exactly measure the group A and group B (Curing agent)
2. Stir: Mix the group B with group A in the container and stir uniformly.
3. Potting: Pot the mixing adhesives into the products asap.
4. Curing: Lay up the potted products at room temperature, process the products after initial curing. Fully curing need 10 to 24 hours.
After curing, use knife to cut the rest adhesive film. Don’t use hand to tear the adhesive film.
Storage and use life:
It is non-dangerous goods, store it in cool and dry place under 30℃. Use life is 12 months. Seal it well after use. Clean the adhesive film if not seal it well, and it does not affect the quality and usage.
Matters need attention:
It’s non-toxic after curing. Keep away from eyes and children.
