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FS-9104 Heat Conduction Potting Adhesive

Product description:FS-9104 is two components organosilicon elastic sealant. It’s specially used for……

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Product description:


FS-9104 is two components organosilicon elastic sealant. It’s specially used for potting and protecting products which need control curing time freely. It provides good performance of water-proof, moisture-proof and gases anti-pollution.


Products features:


1. Two components, long operational time, fast curing after heating. User can control curing time freely.
2. No by-products after curing, and no shrink.
3. Good electrical performance and high temperature resistance after curing.


Technical data sheet:


Before curing

Color

Transparent

Viscosity

1000±100

Weight ratio

1.2~1.4g/cm3

Mix ratio

A:B=1:1

After curing

Viscosity after mixing

1000±100

Breakdown voltage

16Kv/mm

Volume resistivity

≥1×1015Ω*CM

Curing condition

℃/min

25/360 or 80/30


Usage method:


1. Metering: Exactly measure the group A and group B.
2. Stir: Mix the group B with group A in the container and stir uniformly.
3. Potting: Pot the mixing adhesives into the products asap.
4. Curing: Cure the potted products at room temperature or heat curing at 80°C.
5. After curing, use knife to cut the rest adhesive film. Don’t use hand to tear the adhesive film.


Note: The organosilicon potting adhesive can’t cure in some conditions, then use solvent to clean the product surface to avoid problem.
The organosilicon potting adhesive won’t cure when contacting the below chemical substances:


1.  Organotin compounds and silicone rubber containing organotin.
2.  Sulfur, sulfide and rubber materials containing sulfur.
3. Amine compounds and materials containing amine.

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