FS-1801 Thermal Conductive Adhesive
FS-1801 is one component thermal conductive adhesive. It has good thixotropic property and storage stability before curing, and it has no precipitation separation phenomenon. The adhesive is easy to use, with fast curing time, high bonding strength and heat conductive performance. This product is widely used in all kinds of electronic components, thermal module and automatic dispensing equipment.
Product features:
1. Good thermal conductivity, low contraction percentage and low water absorption
2. Great thermal shock performance after curing. It has passed many environmental testing.
3. Good bonding performance to metal materials.
4. Excellent reactivity and won’t flow during curing.
Curing condition:
Curing time: 30 minutes at 160℃.
Using method:
1. It need refrigerated storage (Shelf life is 3 months under 5℃). Put the adhesive at room temperature for 1-2 hours before use. Don’t open the container cover until temperature increases.
2. Keep the bonding surface day and clean.
3. Glue the adhesives to both sides of the parts. Give suitable pressure to the adhesive during its curing to ensure the parts surface can be bonded well.
4. Curing time is 30 minutes at 160℃
5. Seal the adhesive after using and store it in refrigerator under 5℃.
FS-9103 Thermal Conductive Silicone Adhesive
FS-9103 thermal conductive silicone adhesive has good bonding strength and thermal conductivity. It’s neutral RTV silicone adhesive to bond and conduct heat of CPU and radiator, thyristor intelligent control module and radiator, high power electric module and radiator.
Product features:
1. Good bonding strength and thermal conductivity.
2. Super weather resistance and anti-yellowing. Adhesive can keep working for long time and won’t drop.
3. Excellent heat resistance from -50℃ to 250℃.
4. One component, easy to operate.
Technical data sheet:
Appearance | White paste | Weight Ratio | 1.75~1.95g/cm3 |
Linear shrinkage(﹪) | 0.6 | Hardness (Shore-A) | 40 |
Tensile strength | 2.5MPa | Shear strength | 2.0MPa |
Elongation at break | ≥150% | Working temperature | -50~250℃ |
Curing time(25℃,50% humidity) | ≤20 min | Volume resistivity | ≥2.0×1014Ω*CM |
Dielectric constant | 2.8(1.2MHz) | Thermal conductivity〔w/(m.k)〕 | 1.2 |
Using method:
Clean surface: Clean the parts to be glued
Gluing: Open the adhesive pipe cover, glue the adhesive to part surface uniformly, then fix the bonding surface.
Curing: The adhesive will be cured at natural temperature from adhesive surface to inside. The cured adhesive thickness is 2-4mm within 24 hours. Curing time will be longer for deep side parts and in low temperature.
Storage and shelf life:
It’s non-dangerous goods. Store the adhesive at cool and dry place under 35℃. Shelf life is 12 months under 25℃. Seal the adhesive after using it. Remove the adhesive film caused by poor sealing, and it won’t affect adhesive quality.