Product description:

FS-9102B electronic potting adhesive is one component, low modulus neutral organosilicon elastic sealant for potting and protecting high temperature resistance electronic components.

Product Features:

1. Middle viscosity, good flowability, easy to operate.
2. Good performance of resisting climate; Moisture-proof and waterproof.
3. Good flexibility and bending resistance.
4. Good high/low temperature resistance. It works well from -50°C to 250°C.
5.Non-toxic after curing, good adsorbability and chemical resistance.

Technical data sheet:

Usage method:

1. Prepare base material:
Firstly, eliminate the unascertainable factors, such as metal coating and painting surface. Remove the unconsolidated formation of the gluing parts. Make sure it has enough adhesion on coating and painting surface. If adhesion is small, use special cleaner to clean the gluing parts. To make the parts clean, solid and dry. Remove the surface dirt like mold-release agent, curing membrane and hydrophobic agent.
2. Gluing:
Pour out adhesive directly. Bubbles will break automatically when adhesive is flowing.
Clean up the rest adhesive before curing. Process the components 3 hours later. It gets to highest bonding strength 24 hours later (Low temperature will slow down the curing time). After curing, use knife to cut down the adhesive film. Don’t use hand to tear the adhesive film.

Storage and use life:

It is non-dangerous goods, store it in cool and dry place under 30℃. Use life is 12 months. Seal it well after use. Clean the adhesive film if not seal it well, and it does not affect the quality and usage.

Matters need attention:

It’s non-toxic after curing. Keep away from eyes and children.