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Forsen organosilicon potting adhesive for potting electronic components and PCB. It can form a transparent protection film on the PCB to resist moisture, weak acid, weak base, alcohol, mildew and salt spray erode. This product can resist high temperature and won’t drop. The main function: water-proof, moisture-proof, shock-proof, mechanical damage prevention, increase insulation strength, seal the wire, cable, connector and switch box to avoid contacting air. It can be used for TV to avoid corona caused by FBT leaked current. It can be also used for HF COM and electronic equipment to avoid salt fog erosion.
FS-9100PCB hi-temp moisture-proof adhesive:
PCB hi-temp moisture-proof adhesive is one component, low modulus neutral organosilicon elastic sealant for PCB industry potting and protection.
Product Features:
1. Low viscosity, good flowability, easy to operate.
2. Good performance of resisting climate;Moistureproof and waterproof.
3. Good high/low temperature resistance. It works well from -50°C to 180°C.
4.Non-toxic after curing, good adsorbability
Technical data sheet:
| Color | Transparent, white or black | Viscosity | 1000±100 |
| Proportion | 1.0˜1.04g/cm3 | Hardness(Shore A) | 20˜25 |
| Tensile strength | ≥0.8MPa | Shear strength | 0.5MPa |
| Elongation at break | ≥150% | Working temperature | -50˜180°C |
| Breakdown voltage | 20Kv/mm | Volume resistivity | ≥1 * 10 15 Ω * CM |
| Dielectric constant | 2.8(1MHz) | Surface dry time | 60mins.(25°C,50%RH) |
Usage method:
1. Prepare base material:
Firstly, eliminate the unascertainable factors, such as metal coating and painting surface. Remove the unconsolidated formation of the gluing parts. Make sure it has enough adhesion on coating and painting surface. If adhesion is small, use special cleaner to clean the gluing parts. To make the parts clean, solid and dry. Remove the surface dirt like mold-release agent, curing membrane and hydrophobic agent.
2. Gluing:
Pour out adhesive directly. Bubbles will break automatically when adhesive is flowing.
Clean up the rest adhesive before curing. Process the components 3 hours later. It gets to highest bonding strength 24 hours later (Low temperature will slow down the curing time). After curing, use knife to cut down the adhesive film. Don’t use hand to tear the adhesive film.
Storage and use life:
It is non-dangerous goods, store it in cool and dry place under 30℃. Use life is 12 months. Seal it well after use. Clean the adhesive film if not seal it well, and it does not affect the quality and usage.
Matters need attention:
It's non-toxic after curing. Keep away from eyes and children.
